ETSI and MIPI Alliance announce incorporation of MIPI I3C Basic into ETSI smart secure platform

Piscataway, United States and Sophia Antipolis, France. 30 June, 2022 – The MIPI Alliance, an international organisation that develops interface specifications for mobile and mobile influenced industries, and ETSI technical committee secure element technologies (TC SET) announced the adoption of the I3C Interface for SSP (ETSI TS 103 818) specification, allowing the MIPI I3C Basic specification to serve as a physical and logical link layer for the ETSI smart secure platform (SSP).

The I3C interface for SSP joins the family of specifications that underpin the ETSI SSP, the next generation platform for universal subscriber identity module (USIM) and secure elements to meet new market requirements driven by emerging internet of things (IoT), 5G and other security sensitive applications.

The use of the MIPI I3C Basic bus specification provides the ETSI SSP with a multitude of benefits, such as higher data rate, flexible and efficient information exchange, and strong integration of SSP in connected devices – all while decreasing power consumption.

The ETSI SSP is a highly secure, scalable and, thus, cost efficient solution optimised to fit many requirements of security sensitive market sectors, from 5G/6G network authentication and IoT applications, up to complex solutions. The SSP specifications define an open platform for multiple applications with various physical interfaces and form factors, a new flexible file system, and built in capabilities to support several authentication methods, as well as features such as toolkit or a contactless interface defined for the universal integrated circuit card (UICC). ETSI SET has already published six technical specifications and two test specifications related to SSP.

The I3C Interface for SSP (ETSI TS 103 818) adds I3C Basic as one of the possible physical interfaces, in addition to I2C, SPI and ISO 7816. The I3C Basic interface will allow faster communication, a much simplified transfer of data (especially for longer sequences), a robust data error detection and recovery mechanism, and device discovery capability. Thanks to the multidrop configuration of the MIPI I3C Basic bus, the SSP will become accessible to all devices connected to the bus that can benefit from security services that the SSP may offer.

The definition of I3C as a new additional interface to the Smart Secure Platform will greatly help the adoption of the SSP as the new standard secure platform for mobile devices,” says Denis Praca, chair of the ETSI TC SET. “MIPI I3C Basic’s capabilities and wide adoption, added to the power and flexibility of the SSP, offer the right combination for being the successor to the UICC.”

Originally introduced in 2016, MIPI I3C is a scalable, medium speed, utility and control bus interface designed as the successor to I2C. The MIPI specification incorporates key attributes of the traditional I2C and SPI interfaces to provide a unified, high-performing, very low power solution for connecting peripherals to a processor in a wide range of applications, including mobile, IoT, server environments and automotive applications. In these ways, I3C delivers a robust, flexible upgrade path for I2C and SPI implementers. Bundling the features most commonly needed by developers and other standards organisations, MIPI I3C Basic is a publicly available subset of the full I3C specification that also has been adopted in JEDEC’s sideband bus and DDR5 standards.

“MIPI Alliance is very pleased that ETSI TC SET has chosen to adopt I3C Basic as one of the possible interfaces of the SSP. This is a major milestone for industry adoption, as well as significant recognition of I3C Basic’s differentiating characteristics—​​reduced pin count and signal paths, high performance, low power and EMI (electromagnetic interference) and backward compatibility with I2C,” says Sanjiv Desai, chair of MIPI Alliance. “The I3C and I3C Basic specifications are the result of extensive multi-year industry collaboration, and they continue to be enhanced to meet the needs of liaison organisations and their respective ecosystems.”

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PETRONAS Lubricants International celebrates partnership with CNH Industrial brands with development of new and improved lubricants

London, United Kingdom. 30 June, 2022 – PETRONAS Lubricants International (PLI) has renewed its partnership with celebrated makers of agricultural and construction equipment, Case IH and New Holland Agriculture and CASE Construction and New Holland Construction, to announce new products to its already successful PETRONAS Tutela, Akcela & Ambra multi-traction ranges.

The longstanding partnership between PLI and CNH Industrial has been powering the company’s brand’s hard working equipment, with great technical output, with their expertly made Ambra and Akcela lubricants which are specifically designed to ensure all CNH Industrial machinery can perform to its highest standard, even whilst under extreme pressure. Akcela is also the recommended lubricant for STEYR tractors. The shared expertise of engineers and scientists from both PETRONAS and CNH Industrial have produced this high tech lubricant designed to surpass the top performance requirements throughout the agricultural and construction machinery industries.

Launching from April 2022, PLI has now announced an updated range of PETRONAS Tutela, Ambra and Akcela products, specifically for the use on CNH Industrial’s brands machinery. The new PETRONAS Tutela CNH Industrial products will also include the well known professional co branded packaging; that further strengthens the relationship between the two companies.

The new product ranges will include updated and improved CNH Industrial specifications for the gear, hydraulic and grease solutions. These products underwent significant clutch friction testing in order to meet new performance requirements from CNH Industrial at their in-house facility. The new fluids were tested against a base line of twelve different friction materials, resulting in rationalisation and simplification of both hydraulic and gear oils. As the officially recommended range, PETRONAS scientists work in close collaboration with the CNH Industrial team at the santena global research & technology centre to co engineer lubricants that keep equipment thriving through long hours, extreme temperatures and tough terrain.

Equipment produced by CNH Industrial often works in extreme conditions year round, and must always deliver. PETRONAS and CNH Industrial are committed to preventing costly maintenance, giving their customers peace of mind to do their jobs with confidence.

Domenico Ciaglia, regional managing director EMEA, PLI, says “We are proud to celebrate over 25 years of collaboration with CNH Industrial, and also to continue to develop and expand our partnership with our innovative new range of PETRONAS Tutela, Ambra and Akcela oils. Together, we will further enhance the performance and dependability of CNH Industrial Agriculture and Construction machinery and continue to be the recommended lubricants solution.”

Rosella Risso, vice president agriculture – global parts & service, CNH Industrial, says “PETRONAS has been a long-term partner for CNH Industrial.  Our teams of researchers, scientists and mechanics have been working together for decades, and as a result of our successful collaboration, we continue to create even better products. As our machines develop, the lubricant solutions do as well, and we are excited to be expanding our range with PETRONAS to ensure our machines deliver ultimate performance.”

The new PETRONAS Tutela, Ambra and Akcela products, recommended for CNH Industrial, are now available and will be gradually introduced to machines throughout the rest of the year.

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The power of audio meets the power of virtual desktops: EPOS & 10ZiG announce new partnership

Leicester, United Kingdom – EPOS, a global brand designing high end audio solutions for better communication and collaboration, and 10ZiG, a provider of virtual desktop endpoint hardware and software, have partnered to deliver EPOS audio devices and management software optimised for 10ZiG Windows 10 IoT Thin Client endpoint devices.

The recent global pandemic set off the largest work from home (WFH) transition in the history of doing business and is still shaping how we work today. It only made sense that EPOS and 10ZiG joined forces, so the world could leverage hardware and software for remote and hybrid virtual desktop setups. The EPOS & 10ZiG partnership developed as a perfect duo for virtual desktop infrastructure (VDI) and audio communication, in both office and remote setup solutions. Having the most advanced tools in place, including supportive remote Thin Client endpoints and audio headsets makes for an easier and better user experience for unified communications and related platforms.

EPOS connect VDI is the client application that enables various asset management features to allow IT managers to administer EPOS audio devices across the entire organisation through the intuitive EPOS Manager UI. EPOS Manager is a powerful on-premises or cloud based IT management solution for managing, updating, and configuring an organisation’s EPOS headsets and speaker phones from any location.

From entry level to high demand users, 10ZiG Windows 10 IoT Thin Client device models 4610q, 6010q, and 6110, comply and work with EPOS headsets and speakerphones, specifically the ADAPT 660. With the EPOS & 10ZiG partnership, businesses can maximise focus and productivity anywhere with the certified combined solutions.

The EPOS product lines offer a range of outstanding features like superb call clarity, stereo sound, adaptive ANC, and a UC optimised solution with machine learning enhanced microphone performance. The 10ZiG product lines are a range of x86-based Thin & Zero Client endpoints that include a wide array of hardware options, such as varying display connectivity, Fiber options, free centralised management via the 10ZiG Manager, and more.

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Siemens launches building X, an open AI-enabled suite for net zero buildings

30 June 2022 – Siemens Smart Infrastructure has launched Building X, a new smart building suite that is open, interoperable and fully cloud-based. The suite is the first next generation offering built on the design principles of Siemens Xcelerator, an open digital business platform launched today to accelerate digital transformation and value creation across industry, transportation, grids and buildings.

Building X addresses the challenges of various stakeholders, including building users, property investors, real estate companies and facility managers. It acts as a single source of truth to eliminate complexity and supports net zero targets. Stakeholders can now digitise and use their building data from various sources, disciplines and systems on one single platform, Building X.

This enables an user experience and the integration of their existing software and ecosystem, including third party applications, through vendor agnostic connectivity and open application programming interfaces (APIs). The suite offers modular, AI-enabled applications, and built-in cyber security. It also facilitates co-creation with customers and partners to address their challenges faster, thanks to the openness and cloud technology, which means digital transformation can be achieved easier, faster and at scale.

“Building X is the antidote to data silos. We can now connect all data that smart building systems generate in one single data lake, scaling up smart buildings faster and moving closer to our vision of autonomous, net zero buildings. Building X creates data-based outcomes for greater efficiency, performance and experience, changing for the better the way we work and live in buildings,” says Matthias Rebellius, managing board member of Siemens AG and CEO of Smart Infrastructure. “We look forward to co-creating use cases with our customers and partners on Building X to accelerate innovation and sustainability in the industry.”

The Building X suite currently features a set of applications and digital services, tailored to different stakeholder groups, all connected on the AI-enabled platform. Building X opens new possibilities to digitalise, manage, and optimise building operations, bringing value to both existing buildings and new ones.

Its applications cover key domains of building management, including energy, security and building operations, backed by strong analytics capabilities. The applications offer a consistent user experience, where relevant data is intelligently combined to drive outcomes for customers.

A true digital building operations twin

Building X combines the real and digital worlds of buildings by consolidating data from multiple sources into a digital building operations twin. With a virtual representation of a building, building operators can resolve issues faster. Users benefit from the transparency Building X provides in their efforts to make their buildings more sustainable, achieve better building performance and optimise user experience all resulting in higher business outcomes.

A growing set of applications

The Building X applications are designed to be modular and persona-based, providing the right data to the right people. In addition to co-creation possibilities, users can choose from multiple ready-made applications. This makes the single “pane of glass” concept user and workflow-driven, while still allowing dashboards and data insights to be customised according to each user’s needs. As of now, the offering embraces four applications, with more to be added to the platform over time:

  • The Energy Manager tracks energy consumption, costs and CO2 footprint of a building or building fleet and enables early corrective actions if necessary. It forecasts energy consumption based on historical data, and supports users in tracking their sustainability goals, helping them reach net zero buildings.
  • The Operations Manager operates and monitors building equipment and applications in real-time. It can monitor a fleet of sites from one single point and ensures fast issue-response while reducing downtimes. Users benefit from increased business continuity and improved reaction times.
  • The Security Manager operates and maintains security systems with unified and automated workflows. It centrally manages daily security operations and incidents across all systems.
  • The 360° Viewer App represents a location as a virtual 3D environment, allowing for indoor navigation for insights into equipment topology and installation.

SaaS and driving outcomes with building services

Building X is offered as a SaaS (software-as-a-service) model, on a subscription basis. Thanks to the SaaS model, building stakeholders can access software off the shelf, ensuring they always have access to the latest functionality and find upgrades during the building lifecycle to meet their changing needs.

Aside from the SaaS model, customers can also opt for an end-to-end program of Siemens Xcelerator Building Services, which will be enabled by Building X. This allows them to rely on Siemens to achieve their targets. In this model, Siemens leverages a combination of its technology, paired with the expertise of its digital building professionals. The programs are customised to achieve pre-defined outcomes, such as reducing operating and energy costs, optimising asset performance for uptime and productivity, meeting regulatory requirements, or enhancing the occupant experience.

Siemens Xcelerator is an open digital business platform comprising a curated portfolio of IoT-enabled hardware and software, a growing partner ecosystem and evolving marketplace to accelerate digital transformation.

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Advantech introduces COM-HPC module with ultra-powerful AMD EPYCTM Embedded 7003 server processors

Taipei, Taiwan and Munchen, Germany, 30 June 2022 – Advantech, a provider of embedded computing solutions introduced the COM-HPC Server-on-Module with AMD EPYC 7003 Embedded processors at embedded world 2022. With 64 cores, the new COM-HPC Size E Server-on-Modules (200 x 160 mm) provide more than triple the number of available edge server cores compared to any other COM-HPC server module on the market offering edge server engineers an immense performance leap.

Typical applications of the new COM-HPC benchmark module can be found in industrial-grade network technology such as VPN gateways and firewalls with high data throughput requirements of up to 100 GbE and fast buffer storage, telecommunication, and critical edge infrastructures such as 5G base stations, complex mixed-critical industry 4.0 edge servers, or even radar and sonar applications deployed in the security and defense sector.

The benefit of the Server-on-Modules approach in these applications lies in the fact that it is faster and more cost efficient to develop a dedicated server design. As a result, industrial-grade server equipment providers are able to design fully customised solution platforms even for lower volume projects as typically found in industrial applications.

“The launch of the new COM-HPC Size E Server-on-Modules with the powerful AMD EPYC 7003 Embedded processor series enables us to move quickly into the emerging market of modular edge servers, which is very important. Remember that standard server designs are engineered for high-volume sales and offered with largely uniform feature sets. Bringing server-class processing performance to the embedded and edge server space produces customisation needs; and Server-on-Modules address these needs with the processor module and carrier board design principle that is proven and that has been widely deployed for several decades,” explains Dirk Finstel, associate vice president embedded IoT & CTO Europe at Advantech.

“For many years, we have seen the need for customisation in the embedded computing area. The high efficiency of combining modules with custom carrier board designs is the major reason for the massive success of Computer-on-Modules. COMs are the most used board-level products in the embedded computing space. With the COM-HPC Server-on-Module specification, this design principle is now also available for a broad range of entry-class server processors up to the recent AMD EPYC Embedded 7003 processors,” says PICMG president Jess Isquith to underline the importance of the new Server-on-Module specification which Advantech, as a member of the PICMG COM-HPC subcommittee, has been integral in defining.

“It is impressive how quickly Advantech has taken the opportunity to provide our server processors on Server-on-Modules that comply with the new COM-HPC server standard. It shows us that the embedded edge and embedded network server market is gaining significant momentum and that the digitalisation of Industry 4.0 factories and critical infrastructures creates a huge need for customised system designs. With massive generic PCIe Gen 4 lanes, our EPYC 7003 CPUs are ideally designed for tailoring servers to dedicated tasks,” says Amey Deosthali, director of product management, adaptive & embedded computing group at AMD.

Besides the embedded computing power of up to 64 cores and multiple generic PCIe Gen 4 lanes, Advantech’s new SOM-E780 Server-on-Module also boasts the high energy efficiency engineers can have for x86 servers, delivering exceptional performance, reducing energy costs and enabling even passively cooled solutions. Another benefit is the single socket approach, which helps to minimise licensing costs compared to any dual-socket server design.

Built on AMD ‘Zen 3’ microarchitecture-based cores and the AMD Infinity Architecture, AMD EPYC 7003 Series processors provide a full feature set across the stack, with I/O lane counts, 7nm x86 CPU technology, and an integrated security processor on die. They also offer up to 32 MB of L3 cache, 4-6-8 memory channel interleaving to optimise performance in multiple DIMM configurations, and synchronised clocks between fabric and memory technologies that come together to drive leadership performance.

EPYC processors come with AMD Infinity Guard a suite of cutting-edge security features, built into the silicon and designed to defend against internal and external threats. AMD Infinity Guard includes Secure Encrypted Virtualisation (SEV) to help safeguard VM privacy and integrity, Secure Nested Paging (SEV-SNP) for offering strong memory integrity protection, Secure Memory Encryption (SME) to help guard against attacks on main memory, and the AMD Shadow Stack for hardware-enforced stack protection against malware attacks.

The feature set in detail

The new SOM-E780 COM-HPC Server Size E modules from Advantech integrate the latest AMD EPYC 7003 Embedded server-grade CPUs and have a planned long-term availability of at least 5 years. Available in 5 different variants, the new modules offer applications requiring massive parallel computing performance up to 64 powerful AMD ‘Zen 3’ cores for up to 128 threads.

On 4 DIMM sockets, they support up to 512 GB DDR4 RAM with 3,200 MT/s to accelerate server designs with high memory bandwidth demands, multiple memory intensive workloads and virtual machine installations. Also, the staggering set of up to 79 PCIe Gen 4 lanes allows a new class of modular high-performance edge server designs that integrate a broad range of dedicated controllers, computing accelerator cards and NVMe storage media and support ultra high speed I/O communication and networking up to 100 Gbps Ethernet.

For real-time networking the modules additionally offer 1x 2.5 Gbit Ethernet. Further interfaces include 4x USB 3.2 Gen1, 4x USB 2.0, as well as SPI Bus, 12-bit GPIO and 2 COM ports. Conventional hard drives and SSDs can be connected via 2x SATA 3.0 interfaces. Software support is provided for Windows 10 and Ubuntu Linux.

For improved Reliability, Accessibility, and Serviceability (RAS), the new COM-HPC Server-on-Modules support TPM as well as Advantech’s proven remote management and monitoring solution, which consists of iManager including IPMI, Embedded Software APIs and WISE-DeviceOn. In order to optimise time-to-market and design-in security, Advantech offer suitable cooling solutions as well as extensive software design-in services for new AI and edge computing applications.

For more information on the SOM-E780 COM-HPC Server Size E Server-on-Modules, please visit here

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Increasing demand for human-drone collaboration and the maturity of 5G to spur growth in the drone market

The market of small unmanned aerial systems (sUAS), commonly known as drones, continues to grow, and global technology intelligence firm ABI Research predicts total worldwide shipments of sUAS ecosystems to reach 3 million by 2025, increasing at a 25% compound annual growth rate (CAGR). COVID-19 has driven the need for more human-drone collaboration.

At the same time, the maturity of drone hardware and complementary technology such as 5G allows more countries to relax their drone regulations and build up their domestic drone supply chain due to heightened techno-geopolitics disputes.

“Even though COVID-19 had a significant negative impact on the drone industry and worldwide consumer sales have decreased markedly, shipments for civil and commercial use cases have been growing. Moreover, the end of restrictions in most places, except in China and some Asian countries, has accelerated sUAS adoption,” explains David Lobina, industrial, collaborative, and commercial robotics analyst at ABI Research. “The demand for drones has never been higher before in various use cases, such as aerial data collection, infrastructure inspection, disaster response, network assurance, and last-mile delivery.”

Zipline is helping authorities deliver COVID-19 vaccines in Ghana and Nigeria, with a plan to expand medical supplies delivery service into Japan. In addition, employees of large industrial companies are using drones with the help of service providers, such as DroneBase, DroneDeploy, and PrecisionHawk to scan and monitor valuable assets, such as farms and plantations, solar panels, wind turbines, base stations, and commercial towers. “In recent years, the emergence of drone service providers aims to provide dedicated solutions for specific applications, helping end users to learn, adopt, and deploy drones in their daily workflow,” says Lobina.

5G is another critical factor that will spur the growth of drone adoption. Qualcomm, a key 5G chipset vendor, launched the Flight RB5 platform in August 2021, bringing down the barrier to developing 5G-connected drones. While most recent 5G applications focus on Ultra-Reliable Low Latency Communications (URLLC), 5G is expected to provide edge Artificial Intelligence (AI), integration with satellite communication, inter-robot mesh or swarm communications, and most importantly, support for Beyond Visual Line of Sight (BVLOS).

In January 2022, the Northeast UAS Airspace Integration Research Alliance (NUAIR) and the New York UAS Test Site received authority from the Federal Aviation Administration (FAA) to test and fly drones BVLOS across 35 miles of airspace within the New York Drone Corridor. At the same time, Verizon Robotics, the robotics arm of the U.S. 5G telecommunication service provider, has developed software that integrates drones into the U.S. National Airspace System, helping drones can operate safely and together.

David Lobina

The drone industry, unfortunately, is not spared from geopolitics, in particular Sino-U.S. trade disputes. While DJI will continue to dominate the commercial sUAS market and remain the largest manufacturer globally, advanced economies are increasingly concerned with the dominance of Chinese vendors in their technology supply chains. As a result, they are eager to develop domestic chains to reduce their reliance on Chinese vendors.

“Japan is actively building its drone supply chain, with large vendors such as Sony leading the charge. In addition, India looks to become a global drone hub by 2030. It is expected that more hardware vendors will emerge in the next few years with strong government backing.” Lobina concludes.

These findings are from ABI Research’s Small Unmanned Aerial Systems market data report. This report is part of the company’s Industrial, Collaborative, and Commercial Robotics research service, which includes research, data, and ABI Insights. Market Data reports present an in-depth analysis of key market trends and factors for a specific technology.

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Soracom partners with ThingsMatrix to deliver Turnkey services for enterprise IoT

Seattle, USA. 29 June 2022 – Soracom, Inc., a global provider of advanced Internet of Things (IoT) connectivity, announced that ThingsMatrix, an experienced IoT solutions provider that offers full turnkey services, has joined the Soracom Partner Space a growing ecosystem for building and scaling IoT applications to advance asset monitoring for industrial enterprises.  ThingsMatrix offers

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WBA report sets out how wi-fi 6/6E enables industry 4.0

London, UK, 29 June 2022 – The Wireless Broadband Alliance (WBA) has published “Wi-Fi 6/6E for Industrial IoT: Enabling Wi-Fi Determinism in an IoT World“. This paper explores how Wi-Fi’s latest features are ideal for meeting the demanding requirements for a wide variety of existing and emerging IIoT applications. This includes manufacturing/Industry 4.0 and logistics,

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